On March 10, JCET Automotive Electronics (Shanghai) Co., Ltd. (JSAC)—a subsidiary focused on automotive and robotics applications—officially commenced operations in the Lin-gang Special Area. The new facility represents a key strategic move for JCET in the automotive-grade chip packaging and testing sector.

The plant targets high-reliability, high-stability packaging needs for automotive chips, offering end-to-end support from design to mass production. It aims to provide local solutions that help automotive chip companies shorten time-to-market.

The facility strictly adheres to automotive quality systems and meets AEC-Q100 international certification standards—a rigorous qualification involving 41 tests across seven groups to ensure chip stability under extreme conditions.

Previously, China's high-end automotive chip packaging heavily relied on overseas suppliers. This project reduces supply chain risks, fills a gap in domestic high-end packaging capabilities, and supports the autonomous control of the smart automotive industry.

The Lin-gang area now hosts numerous chip-related companies, and the new plant will drive deeper collaboration between the IC and smart vehicle sectors in technology and supply chains.

ICgoodFind: JCET's new facility addresses a critical gap in domestic automotive packaging, accelerating chip localization for smart vehicles and robotics.