02
2026-06
At Computex Taipei, Intel launched multiple data center and AI products built on its 18A (1.8nm‑class) process . The Xeo...
01
2026-06
Maxio Technology disclosed that its first self‑developed UFS 3.1 embedded controller has entered mass production and shi...
29
2026-05
TrendForce has sharply raised its global memory market forecast. **2026产值 is now expected to reach 889.3billion∗∗(upfrom...
28
2026-05
Loongson Technology announced a private placement of up to RMB 2.3 billion ($317M) , issuing up to 40.1 million A‑shares...
27
2026-05
Kioxia has postponed mass production of its tenth‑generation BiCS10 3D NAND flash from 2026 to 2027 . The new flagship t...
27
2026-05
NXP NX3008PBKV: A Comprehensive Technical Overview of the Advanced Power Management IC The NXP NX3008PBKV represents a s...
26
2026-05
Panasonic and Kemet have announced capacitor price hikes ranging from 5% to 65% , driven by surging AI server and data c...
25
2026-05
Facing persistent Western technology sanctions, Russia’s Sberbank CEO German Gref announced that the bank plans to procu...
20
2026-05
Former Samsung DS head Kye‑hyun Kyung predicts memory chip prices will peak and fall in the second half of 2027 , driven...
19
2026-05
Anlogic has broken out of the traditional substitution framework with cumulative shipments nearing 300 million units and...
18
2026-05
Xiaomi President Lu Weibing confirmed during a live event that the company will launch a new iteration of its in-house X...
15
2026-05
NXP 74HCT1G126GV: A Comprehensive Technical Overview of the Single Bus Buffer Gate IC The NXP 74HCT1G126GV is a high-spe...
