Kuaishou‑Spun Lingchuan Secures Series A+ Funding for Video AI Chip Expansion

Release date:2026-06-25 Number of clicks:71

Lingchuan Technology, an AI chip company spun out of Kuaishou, has completed a Series A+ round worth several hundred million RMB. The round was led by Qifu Capital, with participation from Newland, Jinpu Capital, Zhaohui Capital, Baidu Ventures, Shuimu Investment, E‑Town Phase II Fund, and multiple overseas family offices, alongside existing investors.

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Based in Beijing E‑Town, Lingchuan will use the funds to develop next‑gen AI chips, expand production of its SL200 video intelligence processor , and build global sales channels.

Founded in March 2024, Lingchuan originated from Kuaishou’s in‑house accelerator team. Its SL200 SoC – a video‑focused AI chip – is already deployed in tens of thousands of units across Kuaishou’s platform, serving 700 million users. A new chip built on a domestic 3D near‑memory architecture completed tape‑out in April, targeting improved thermal and reliability performance.

ICgoodFind: Kuaishou’s Lingchuan brings 3D‑stacked, near‑memory video AI chips to market – a local compute alternative for large‑model inference.

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